Products and Services
Wafer substrate
Wafer substrate
Specifications, dimensions:
6-inch, 8-inch/12-inch
Processing method:
Cutting - CNC - Sanding - Grinding - Fine Polishing - Cleaning - Inspection
Usage:
carrier substrate
Technical specifications:
Flatness <1μm, local flatness <30nm, Ra value <0.2nm, thickness uniformity (within ±2%).
Application areas:
Glass
Product types:
flat
Application terminal:
Semiconductor Communication
Affiliated Branch:
Product Description
The wafer substrate plays a critical supporting role in numerous applications, ranging from front-end wet etching/CVD processes to advanced packaging in the back end.
Our company offers a wide range of material options: quartz, YAG (yttrium aluminum garnet), sapphire, Borofloat 33, D263T eco, B270, Eagle XG...
Light and Processing Capability:
Size: 1-12 inches, various wafer sizes
Board thickness: 30~10000μm, customizable
TTV: 8 inches @ 5μm, mass production proven
Coating: Sputtering, evaporation, spraying available
Customization: Tailored to your specifications to meet your needs
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We welcome your message or inquiry.